- Substrate Technology of Inner Layer Milling
- 2016-12-14 03:18
- Description:.desc-content { min-height: 250px }1.Inner Layer Milling Technology 2.Patent approved 3.Gold plating4.Glass
- Rigid PCB for Chip size Package (CSP)
- 2016-12-14 03:18
- Description:.desc-content { min-height: 250px }1.Plastic PCB 2.High Technology 3.Gold Plating 4.Glass Epoxy•KEYTECHNOLO
- Chips on Board (COB) of PCB sellers
- 2016-12-14 03:18
- Description:.desc-content { min-height: 250px }1.Milling-out Technology 2.Gold plating 3.available for multi chipsmounti
- Japanese PCB for BGA
- 2016-12-14 03:17
- Description:.desc-content { min-height: 250px }1.EBGA MBGA CSBGA 2.Inner Layer Milling Technology 3.Excellent heatdissip
- Multi Chip Module(MCM) of Multi PCB
- 2016-12-14 03:17
- Description:.desc-content { min-height: 250px }1.Inner Layer Milling Technology 2.Patent approved 3.Applicable forhigh d
- High Dam Printing Technology for Printed Circuit Board
- 2016-12-14 03:17
- Description:.desc-content { min-height: 250px }1.Dam Printing 2.0.1~0.8mm height can be formed 3.EpoxyHigh Dam Printing
- PCB Technology of Flat Push Back
- 2016-12-14 03:17
- Description:.desc-content { min-height: 250px }1.Plastic PCB 2.High Technology 3.Gold Plating 4.Glass EpoxyFLAT PUSH-BAC
- EBGA of Japanese PCB
- 2016-12-14 03:17
- Description:.desc-content { min-height: 250px }1.EBGA MBGA CSBGA 2.Inner Layer Milling Technology 3.Excellent heatdissip
- Japanese PCB Technology of Inner Layer Milling
- 2016-12-14 03:17
- Description:.desc-content { min-height: 250px }1.Inner Layer Milling Technology 2.Patent approved 3.Gold plating4.Glass