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Description:
1.Inner Layer Milling Technology 2.Patent approved 3.Applicable forhigh density mounting 4.Glass EpoxyJapanese PCB for Multi ChipModule(MCM)It is possible to supply PCBwith single or multi cavities available for mounting multi barechips and QFP on it by mixing our original processing technologies,such as precision multi-lamination technology, inner layermilling technology, STH technology, fine patterningtechnology, etc. In result, it enables to achieve multi-functionand multi chip module PCB.
•KEY TECHNOLOGY
| FA & Robot | Automobile | Medical & Sensing | LED | Chip size Package | High Frequency Module | Chip on Board | BGA | Multi Chip Module | |
| Inner Layer Milling Technology | A | B | A | B | A | A | A | A | A |
| High Dam Printing Technology | A | B | A | B | A | A | A | A | A |
| Laser via Technology | A | B | A | B | A | A | A | A | A |
| Stacking Technology | A | B | A | A | B | A | B | A | A |
| Electroless Soft Gold plating Technology | A | A | A | A | A | A | A | A | A |
| Pin Caulking Technology | B | B | A | B | B | A | B | A | B |
| Dry Film Tent on Via Technology | B | B | B | A | A | B | A | B | B |
| Punching Technology | B | B | B | A | B | A | B | B | A |
| Flat Push Back Technology | A | A | A | A | B | A | B | B | A |
A=Delivered record /B=Possible
•CAPABILITIES
Panel size= 340x340mm
406x340mm
510x340mm
Thickness = 0.06-3.0mm
Material = Hitachi, Mitsubishi,Matsushita,
Risho, Kyocera, Rogers
Capacity = 10, 000m²/month over
Products = Dual side PCB
Multi-layer PCB (3-16layers)
Build-up PCB
