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Description:
1.Milling-out Technology 2.Gold plating 3.available for multi chipsmounting 4.Glass Epoxy Chip onBoard(COB)
This PCB is a chip on board for high dense components mountingenabling to
make electric apparatuses compact and thin and also is availablefor multi chips mounting.
•KEYTECHNOLOGY
| FA & Robot | Automobile | Medical & Sensing | LED | Chip size Package | High Frequency Module | Chip on Board | BGA | Multi Chip Module | |
| Inner Layer Milling Technology | A | B | A | B | A | A | A | A | A |
| High Dam Printing Technology | A | B | A | B | A | A | A | A | A |
| Laser via Technology | A | B | A | B | A | A | A | A | A |
| Stacking Technology | A | B | A | A | B | A | B | A | A |
| Electroless Soft Gold plating Technology | A | A | A | A | A | A | A | A | A |
| Pin Caulking Technology | B | B | A | B | B | A | B | A | B |
| Dry Film Tent on Via Technology | B | B | B | A | A | B | A | B | B |
| Punching Technology | B | B | B | A | B | A | B | B | A |
| Flat Push Back Technology | A | A | A | A | B | A | B | B | A |
•CAPABILITIES
Panel size =340x340mm
406x340mm
510x340mm
Thickness = 0.06-3.0mm
Material = Hitachi, Mitsubishi,Matsushita,
Risho, Kyocera, Rogers
Capacity = 10, 000m²/month over
Products = Dual side PCB
Multi-layerPCB (3-16 layers)
Build-up PCB
