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Description:
1.EBGA MBGA CSBGA 2.Inner Layer Milling Technology 3.Excellent heatdissipation 4.Gold plating 5.Glass EpoxyEBGA MBGA CSBGA
This EBGA consists of fine pattern BGA with high Tg resin and metalheatspreader
with high thermal conductivity. Therefore, it is most suitable forhigh speed driven IC
packages by its excellent heat dissipation.
•KEYTECHNOLOGY
| FA & Robot | Automobile | Medical & Sensing | LED | Chip size Package | High Frequency Module | Chip on Board | BGA | Multi Chip Module | |
| Inner Layer Milling Technology | A | B | A | B | A | A | A | A | A |
| High Dam Printing Technology | A | B | A | B | A | A | A | A | A |
| Laser via Technology | A | B | A | B | A | A | A | A | A |
| Stacking Technology | A | B | A | A | B | A | B | A | A |
| Electroless Soft Gold plating Technology | A | A | A | A | A | A | A | A | A |
| Pin Caulking Technology | B | B | A | B | B | A | B | A | B |
| Dry Film Tent on Via Technology | B | B | B | A | A | B | A | B | B |
| Punching Technology | B | B | B | A | B | A | B | B | A |
| Flat Push Back Technology | A | A | A | A | B | A | B | B | A |
•CAPABILITIES
Panel size = 340x340mm
406x340mm
510x340mm
Thickness = 0.06-3.0mm
Material = Hitachi, Mitsubishi, Matsushita,
Risho, Kyocera, Rogers
Capacity = 10, 000m²/month over
Products = Dual side PCB
Multi-layer PCB (3-16 layers)
Build-up PCB
