We are able to meet different requirements of techniques and customers??needs.

Single side(d)

Double sides

Multi-layer boards(4-24layers)

Bury and blind via holes

Back board and chip on board for wire bonding

Plugged via with resin

Heavy copper up to 8OZ

Impedance control(min 30ohm /-10%)

Rohs compliance

Our quality assurance: ISO9001 / ISO14001 / TS16949 / UL / Rohs

We can provide high quality through them:

CEM-3/FR4:HTg,low DK,halidfree,high ...