APACK is a heatpipe technology based thermal solution provider which provides customized designing and engineering solutions and, ultimately, provides best-of breed thermal solutions.
APACK`s design and manufacturing is based upon an engineer`s passion for innovation and progress. APACK was established in 1999 by 3 engineers from ETRI (Electrics and Telecommunications Research Institute) who have 10~17 years experience in thermal solutions and advance packaging technology (packaging referring to the structural and functional integration of multiple technologies) . Based in the city of Daejeon (Korean Silicon Valley and high-tech capital) , APACK is staffed with top engineers who have extensive experience.
APACK is currently entering into its second phase of business development after accomplishing its first goals of developing a strong R& D core in thermal technology and efficient manufacturing capabilities. Phase one was marked by strong revenues and growth in the OEM and custom solutions market producing for such clients and Samsung, Dell and LG.
Backed by investors such as Intel Capital, a strong backbone of R& D with continued cooperation with ETRI and APACK is seeking to become a global player in the thermal solutions market.
APACK`s CI
The name APACK began as an acronym of Advance Packaging and Creative Knowledge. This was actually the subject of the PHD thesis of the founders of APACK. Advance Packaging is actually an engineering field referring to the integrating of different micro electronic technological areas to optimize operations; while Creative Knowledge represents a call to innovation. APACK prides itself on being a company that has its own specialized R& D, design, engineering and production capabilities.
The logo of APACK is the image of new spring grass pushing itself out the ground to feel the sun. It is a symbol to never forget that success is a product of a continuing struggle to always be ready to start again as like the new spring grass.