Description:
This Slice saw is used to cut blank strips or wires ofsemiconductor materials, glass and quartz crystals.Usage:
This slice saw is used to cut blank strips or wires ofsemiconductor materials, glass and quartz crystals. It can also beused to cut high precision small plate. It adopted PLC Controlwhich displays operation parameters and can set up according to therequirements of materials (Number of plates, thickness andprecision). Fullautomatic cutting
Parameters:
1.Maxsize of blanks: 220mm×200mm×100mm
2.Min. Thickness of plates: 0.4mm
3.space between spindle center and work table: 100~270mm
4.Cutting Blade: (Provided by customer themselves)
External Diameter: 150~300mm
Internal Diameter: 30mm
5.Max. Longitudinal stroke of work table: 200mm
6.Max. Transverse stroke of work table :220mm
7.Round table rotation angle: vertical 360°, scale value 1''
Horizontal ±10°, scale value 2''
8.Falling speed of cutting blade: 0.5~60 mm/min
9.Motor: AC380V, 50Hz
10.Speed of spindle: 1840rpm, 2260rpm
11.Work Pressure of Hydraulic system: 1.5Mpa
12.Spindle Cylinder cutting pressure: 0.3Mpa~1Mpa
13.Overall Size: 1350mm×1000mm×1920mm
14Weight: 1500kg
