Description:
pcbboard
1) Layer: 10 HDI pcb board
2) Board finished thickness: 1.0 mm
3) Material: FR-4
4) Min. drilled hole size: 0.3mm
5) Min. Line width: 4mil (0.1mm)
6) Min.Line spacing: 4mil (0.1mm)
7) Surface finish/treatment: Immersiongold
8) Copper thickness: 1 OZ
10) Solder mask color: Green
11)Inner packing: Vacuum packing / Plasticbag
Outer packing:Standard carton packing
12) Sample or mass produce, 5 to 8 days leadtime
13) OEM/ODM is acceptable
Reference- Our Production Capability for Multilayer PCB/Rigidborad
Item
| M- |
Layer count | 1-30 layers |
Material | FR4(High TG, Halogen Free, high frequency), CEM1,CEM3, BT, Al base mateiral, and so on. Supplier: SY, KB, ITEQ, Isola, Nelco, Rogers,Grance, Mitsui |
Maxpanel size | 32±20(800mm±508mm) |
Min width/space(min) | 4mil/4mil |
Max copper weight | 140um(4oz) for inner layer 175um(5oz) for outer layer |
Min machine drill size | 0.2mm(8mil) |
Via hole tpye | Blind/Burried/plugged |
Thickness of finished board | 0.20-6.0mm |
Tolerance | Registration of innerlayer to ofinnerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: /-0.1mm Thickness>0.1mm:/-10% Outline router: /-0.1mm Outline Score: /-0.2mm |
Color of solder mask | Green, Black, Blue, Red, White and so on |
Surface freatment | HASL, HASL Lead Free, OSP , Immersion Gold,Immersion Ti, Immersion Sliver, Flash gold, Selective Goldplating(gold thicness up to 120u), Gold figers , Carbon print,Peelabe Mask |
Hardness of solder solder | >=6H |
Outline finished | CNC, V-CUT, Punching |
Peel strength of line | ≥61B/in |
Warp and twist | ≤0.7% |
