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Description:
1.Soft board2.material:fr-4
3.board finished thickness:1.0 mm
4.surfact treatment:Immersion GoldTechnical discription:Flexible pcb
layer: 4 layer Flexible pcb
material: PI
Board thickness: 0.3mm
Surface finish: immersion gold
Min through hole: 0.3mm
Min line width: 0.1mm(4mil)
Min line space: 0.1mm(4mil)Flex board capability:
| Technical Specification | |||
| Materials | Polyimide/Polyester | Remark&Test Method | |
| Number of Layer | FPCB 1-8/Rigid-flex:3-6 | ||
| Min.Trace Width/Space | Single Side | 0.050mm(2mil) | |
| Double Side | 0.050mm(2mil) | ||
| Min.Hole Diameter | Drilling(P.T.H.) | φ0.15mm | |
| Punching | φ0.50mm | ||
| Dimension Tolerance | Conductor Width | 20% | W≤0.5mm |
| Hole Diameter(H) | 0.05mm | H≤1.5mm | |
| Accumulated Pitch | 0.05mm | P≤25mm | |
| Outline Dimension | ±0.1mm | L≤50mm | |
| Conductors And Outline | ±0.07mm | C≤5.0mm | |
| Surface Treatment On Terminal And Land Area | Au(0.03-1.5um) | ||
| Ni(1-6um) | |||
| Sn(7-20um) | |||
| Peeling Strength(180° Direction) | 1.0kg f/cm | IPC-TM-650 2, 4, 9 | |
| Solder Heat Resistance | 260/10 secs | ||
