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Description:
Four Tin plate;Four layers of lead free board;Four layers of heavygold plate;Double Sided butter lead-free board| Process capacity |
| Product category:single,dorble-sided/multi-layer(2-36)HASLPlated GoldlmmersionGold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, HighFrequency Board, Aluminum base Board Flex-Rigid PCB, Teflon Board,and HDI |
| base materialFR-4, Alluminum, Non-halogen, Lead-freeCompatibility , High TG, High CTI, CEM-1, CEM-3, Teflon |
| Max processing dimensions700mm×600mm |
| Thickness of board0.2mm-3.4mm |
| Outline Process Precision:±0.08mm |
| oard Width of the Inner Layer :0.075-1.6mm |
| Exterior Copper Width :18-210um |
| Exterior Copper Width :12-210um |
| Minimum Width of the Welding Ring :0.10mm |
| Minimum Width of Bridge with Solder Mask :0.01mm |
| Tolerance of Solder Resistance:±5% |
| Thickness of base copper foil18μ35μ70μ |
| Min. hole size0.1mm |
| Hole dia. Tolerance(PTH):±0.075mm |
| Hole dia. Tolerance(NPTH):±0.05mm |
| Min. line Space 0.075mm |
| Min. line Width(PTH)0.075mm |
| BURIED/BLIND VIA:compaction or HDI |
| Solder maskliquid photo-imageable (LPI) solder mask andthermosetting solder mask( Green, Yellow, Red , Black, Blue ) |
| PROFILING METHOD:PUNCH, CNC, HANDSET, TRIMMING |
| Surface Treatment :HAL, Plated Nickel/ Gold, Immersion Gold,Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, TinPlating , Immersion Silver, Immersion Tin, Thickly Plated GoldFinger, Immersion Gold Thickly Plated Gold Finger, Immersion SilverThickly Plated Gold Finger, Immersion Gold OSP |
| Tolerence of contour processing 0.1mm |
| Being flame-resistant characteristic:94V-0 |
| Twist and wrap:< 0.5% |
| Specification: under IPC-600F class-II , IPC-ML-950 orcustomer`s requirement |
| CERTIFICATEUL NO. E305540;TL9000,ISO9002;ISO14001:2004;QS9000;TS16949, E169497 |
