Brand:Kinglisheng
MOQ:500 Square Met
Quantity:150000 Square Met
Delivery date:Since payment date 15 Days delivery
Product Details:
Number of Layers:8-Layer
base Material:FR4
Copper Thickness:2 Oz
Board Thickness:1.6 mm
Min Hole Size:0.2mm
Min Line Width:0.075mm
Min Line Spacing:0.075mm
Surface Finishing:Immersion Tin
Specifications:
- base Material:FR4/Aluminum ODM, OEM ROSH, ISO9001, UL certificateOne-stop Service from PCB to PCBA Quick delivery
Description:
PCB Capability
1 layers: 1-30 layers .
2 Material: FR4, High Tg FR4, Halogen Free, Rogers, Aluminium.
3 Finished board thickness: 0.2mm-7.0mm .
4 Copper thickness: 1/3Oz - 7Oz .
5 Surface finish: HASL, Lead Free HAL, Immersion gold, Goldplating, Immersion Silver, OSP, Carbon .
6 Min.Trace Witdth/Space: 3 mil.
7 Min.Finished Hole size: 0.1 mm
8 Max.Finished Hole size: 20.94" x24.4" .
9 Hole tolerance PTH: +/-0.076mm, NPTH: 0.05mm .
10 Soldermask color: Green, White, Black, Red, Yellow,Blue
11 Silkscreen color: White, Black, Yellow, Blue
12 Impedance control: +/-10% .
13 Profiling punching: Routing, V-Cut, Chamfer .
14 Special holdes: Blind/Burried holes, Countersunk holes.
15 Reference standard: IPC-A-600G Class 2, Class 3.
16 Certificate: UL, ISO9001, ROHS, SGS
17 Package: Vaccum & Carton
PCBA Capability
1 Min IC Pin: 0.30mm .
2 Foot Pin: S0, SOP, SOJ, TSOP, TSSOP, QFP, BGA &U-BGA.
3 Min Chip Placement: 1005.
4 Max PCB Size: 410 x 610.
5 Min PCB Thickness:0.35mm.
6 Max BGA Size: 74 x 74mm.
7 BGA Ball Pictch: 1mm -3mm.
8 BGA Ball Diameter: 0.4mm -1mm.
9 QFP Lead Pitch:0.38mm-2.54m.
10 Package: Anti-static bubblebag & carton


