NO

        Item

      Craft Capacity

1              

Layer                                                 

1-30Layers                                                                               

2

base Material for PCB

FR4, CEM-1,TACONIC, Aluminium, High Tg Material, HighFrequence ROGERS , TEFLON, ARLON, Halogen-freeMaterial

3

Rang of finish baordsThickness

0.21-7.0mm

4

Max size of finishboard

900MM*900MM

5

Minimum Linewidth

3mil (0.075mm)

6

Minimum Line space

3mil (0.075mm)

7

Min space between pad topad

3mil (0.075mm)

8

Minimum hole diameter

0.10 mm

9

Min bonding paddiameter

10mil

10

Max proportion of drilling holeand board thickness

1:12.5

11

Minimum linewidth ofIdents

4mil

12

Min Height of Idents

25mil

13

Finishing Treatment

HASL (Tin-Lead Free),  ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold),OSP, etc.

14

Soldermask

Green, White, Red, Yellow, Black,Blue, transparent photosensitive soldermask, Strippablesoldermask.

15

Minimun thickness ofsoldermask

10um

16

Color of silk-screen

White, Black, Yellowect.

17

E-Testing

100% E-Testing (High VoltageTesting);  Flying Probe Testing 

18

Other test

ImpedanceTesting, ResistanceTesting, Microsection etc.,

19

Date file format

GERBER FILE and DRILLING FILE,PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB

20

Special technologicalrequirement

Blind & Buried Vias and HighThickness copper

21

Thickness of Copper

0.5-14oz (18-490um)