Send Inquiry
Description:
;6 layer HID PCB;Four Tin plate;Four layers of lead free board;Fourlayers of heavy gold plate, Lead free HASL PCB, FR4 sigle boar| Process capacity |
| Product category:dorble-sided/multi-layer(2-24)HASLPlatedGoldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind ViaBoard, High Frequency Board, Aluminum base Board Flex-Rigid PCB,Teflon Board, and HDI |
| base materialFR-4, Alluminum, Non-halogen, Lead-freeCompatibility , High TG, High CTI, CEM-1, CEM-3, Teflon |
| Thickness of board0.2mm-3.0mm |
| oard Width of the Inner Layer :0.075-1.6mm |
| Max processing dimensions700mm×600mm |
| Thickness of base copper foil18μ35μ70μ |
| Min. hole size0.1mm |
| Conductor Min. line Width/ Space of the Inner/Outlayer Layer0.08mm |
| Solder maskliquid photo-imageable (LPI) solder mask andthermosetting solder mask( Green, Yellow, Red , Black, Blue ) |
| Outline Process Precision:±0.08mm |
| Surface Treatment :HAL, Plated Nickel/ Gold, Immersion Gold,Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, TinPlating , Immersion Silver, Immersion Tin, Thickly Plated GoldFinger, Immersion Gold Thickly Plated Gold Finger, Immersion SilverThickly Plated Gold Finger, Immersion Gold OSP |
| Tolerence of contour processing 0.13mm |
| Twist and wrap:< 0.8% |
| Specification: under IPC-600F class- or customer`srequirement |
