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Description:
1. pcb designing and assembly services2.Reliable quality, competitive price
3. Provide wide range of choice for component
| Material | CEM-1, CEM-3, FR-4 High TG FR-4, Lead free material(ROHSCompliant), Aluminium |
| Layers | 1-18 |
| Board Thickness | 0.2mm-4mm |
| Thickness Tolerance | ±10% |
| Copper Thickness | 0.5OZ-60OZ |
| Max Panel Size | ≤2sides:600x1200mm, Multi layers:500x1200mm |
| Panel Outline Tolerance | ±0.1mm |
| Min Space Width | ≥0.075mm |
| Min Trace Width | 0.125mm |
| Min SMT Pad Spacing | 0.1mm |
| Min Hole Size | 0.5mm |
| Min Punch Hole Size | 0.9mm |
| Hole Size Tolerance | PTH:±0.075MM, NPTH:±0.5mm |
| Hole Position Tolerance | ±0.075mm |
| Solder Mask Thickness | 0.018mm |
| Warp & Twist | ≤0.6% |
| Impedance Control | ±5% |
| Peelable | 0.3mm-0.5mm |
| Min Solder Mask Bridge | ≥0.08mm |
| Outline profile | Rout/V-CUT/Bridge/Stamp Hole |
| Surface Treatment | OSP: 0.5um |
| HASL:2.5um | |
| Lead Free HASL: 2.5um | |
| Carbon Ink | |
| Gold plating: AU 1-5u'''' | |
| Immersion Tin: 0.8-1.2um | |
| Immersion Silver:0.1-1.2um | |
| ENIG:AU 1-5U'''' | |
| Certificate | ISO9001, UL, ROHS, SGS |
| PCB Assembly Service | 1.SMD/DIP/AI |
| 2.Undertake the whole project of the PCB, including thepurchase of the components, provide customers a wide range ofchoice for components under cheap price, help to reduce the cost atthe same quality. | |
| 3.Accept OEM/ODM project | |
| 4.Accpet small orders | |
| 5.Fast sample | |
| Package | Inner antistatic bag /antistatic bubble bag, outside cartonpacking or according to customer''s requirement |
| Usual delivery | 4-6weeks |
