Description:
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1. Lead free HASL
2. Certificate: UL, ROHS, T/S16949
3. Company management: ISO9001:2000
4. Markets: Euro
Lead free HASL PCB
-Lead free HASL Surface finish required to meet ROHScompliant
-FR4 material with 0.2mm-3.2mm boards thickness
-Copper weight:0.5OZ, 1OZ, 2OZ, 3OZ
-4-4mils track width spacing
-0.2mm min finished hole size
-Certificate: UL, ROHS, T/S16949
-Company management: ISO9001:2000
-Markets: Europe, America, Asia
Factory ManufactureCapability.
Item | Manufacture Capability | |
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3,Aluminium, metal based | |
Layer No. | 1-16 | |
Finished Board thickness | 0.2 mm-3.8mm’(8 mil-150 mil) | |
| ||
Board Thickness Tolerance | ±10% | |
Cooper thickness | 0.5 OZ-11OZ (18 um-385 um) | |
Copper Plating Hole | 18-40 um | |
Impedance Control | ±10% | |
Warp&Twist | 0.70% | |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) | |
Images | ||
Min Trace Width (a) | 0.1mm (4 mil) |
|
Min Space Width (b) | 0.1mm (4 mil) | |
Min Annular Ring | 0.1mm (4 mil) |
|
SMD Pitch (a) | 0.2 mm(8 mil) |
|
BGA Pitch (b) | 0.2 mm (8 mil) | |
|
| |
Solder Mask | ||
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
|
Soldermask Clearance (b) | 0.1mm (4 mil) | |
Min SMT Pad spacing (c) | 0.1mm (4 mil) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Min Hole size (CNC) | 0.2 mm (8 mil) | |
Min Punch Hole Size | 0.9 mm (35 mil) | |
Hole Size Tol ( /-) | PTH:±0.075mm;NPTH: ±0.05mm | |
Hole Position Tol | ±0.075mm | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-5u'''' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol ( /-) | CNC: ±0.125mm, Punching: ±0.15mm | |
Beveling | 30°45° | |
Gold Finger angle | 15° 30° 45° 60° | |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate | |
