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Description:
0201 placement BGA precision: 0.5mm ICprecision: 0.4mm Experienced components sourcing team, speciallyfor scarce parts Power boards with lead-free though-hole technologyUp to 22 layers mixed assembly technology used on communicationsSpecialized in assembling boards for network and communication,industry control Type of productions: SMT, though-hole BGA and COBPlastic injection Die-casting Sheet metal stamping X-ray and ICTtest Within two hours to reply the inquiry such as E-mail, two tothree working days to provide the quotations Professionalengineering staff to provide technical support before and aftersales With IPC610 manufacturing and other international standardsOEM and ODM orders welcome
