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Description:
Digital camera;Medical supplies, Handset, Mp4, Photographs first,DVD, Sound, Coupling FPC.| Content | Specification |
| Product category | single-sided/double-sided/Delamination board/flex-rigid board,Hollow board |
| Multi-layer FPC Max Layer | 8 Layer |
| Rigid-flex FPC Max Layer | 10Layer |
| Dimension of Finished Board (Utmost) | 250* 500mm |
| Board Ply (maximum) | 0.4mm |
| Board Ply ( minimum ) | 0.04mm |
| Tolerance of Thickness of Finished Product (0.075mm Board Ply< 0.4mm ) | ± 0.03mm |
| Min Hole size-CNC Drilling | 0.15 mm ( 6mi l) |
| Min Hole size-Punching Hole | 0.5 mm ( 20 mil ) |
| Diameter of Finished Hole ( minimum ) | 0.15mm |
| Thickness of base Copper( minimum ) | 1/ 3oz |
| Thickness of base Copper ( maximum ) | 1oz |
| thickness of plating layer | flash gold board:Ni layer: 1--5μm |
| plated tin board | Sn layer: 8--25 μ m |
| Dielectric Thickness ( minimum ) | 1/2mil |
| Dielectric Thickness ( maximum ) | 3mil |
| Material | PI/ PET |
| Hole Plating Aspect Ratio ( maximum ) | 7:01 |
| Hole Diameter Tolerance ( PTH ) | ± 0.050mm |
| Hole Diameter Tolerance ( non-PTH ) | ± 0.050mm |
| Hole Position Tolerance( Compared with CAD ) | ± 0.076mm |
| PTH Wall Thickness | ≥0.015mm |
| Min trace width& space-Single side | 0.038 & 0.038 mm ( 1.5 mil & 1.5 mil ) |
| Min trace width& space-Double side | 0.050 & 0.050 mm ( 2 mil & 2 mil ) |
| Min trace width& space-COF Chip on Flex | 0.02 & 0.02 mm ( 0.8 mil & 0.8 mil ) |
| Tolerance of Line Width | ± 20%( normal ) |
| Solder Mask Thickness ( minimum ) | 7.6um line angle |
| Thickness and Tolerance of Nickel Plated Gold Finger | 2.54um~~5um |
| Thickness and Tolerance of Gold- Plated Gold Finger | 0.025um ~~0.2um |
| Thickness of Immersion Nickel/ Gold (Minimum- Maximum) | 2.54um~5um/0.025um~0.1um |
| Tolerance of Punch Hole Diameter | ± 0.05mm |
| Outline Tolerance (Laser cutting ) | ± 2mil( ± 0.05mm ) |
| Outline Tolerance (Fine Steel Mould) | ± 3mil( ± 0.075mm ) |
| Outline Tolerance (Steel Mould) | ± 4mil( ± 0.1mm ) |
| Reinforcement type | FR4PISteel disk PETSilicon steel plate, aluminumsheet |
| Half round hole min hole diameter | Φ=0.35mm |
| Item | Content |
| Impedance Tolerance of Finished Board (Minimum) | ± 10% |
| Circumference Void Test Voltage | 200 ± 5V |
| Short-Circuited Resistance | 10M Ω |
| Open-Circuited Resistance | 30 Ω |
| Solderability Test | 260 ± 10 , Time: 10Sec |
| Thermal Shock | IPC-TM-650 2 . 6 . 7 |
| Chemical Resistance | IPC-TM-650 2 . 6 . 3 |
| JIS C5016 7 . 6 | |
| Insulation Resistance | IPC-TM-650 2 . 6 . 3 |
| JIS C5016 7 . 6 | |
| Withstanding Voltage | IPC-TM-650 2 . 5 . 7 |
| Salt Spray | IEC 68-2-11 |
| Surface finish | Tin/Lead Electroplating; H.A.L;Immersion Tin;Hard GoldElectroplating;Soft Gold Electroplating;Immersion Gold;O.S.P |
| Note:1. Deliver Period for Samples: Single-sidedBoard: 2-3 days; Double- sided Board: 3-5 Days; Multi-layer Board:6-7 days. For manual samples, the cap is 5 verities. | |
| 2. Deliver Period for Bulk Production: Single anddouble-sided Boards: 6-7 days; Multilayer Boards: 8-10 days; andfor the mass-produced boards, the mould must be made forproduction. | |
| 3.Check product standards: except the specialacquirement, we will abide by IPC-6013 IPC 600 | |
