Description:
- 6 inch wafer expand sheet machine- High accuracy expansion
- Simple mechanism
- Easy maintenance
Overview
Wafers require carefully handling to ensure narrow streets andprevent edge chipping after dicing.
The TEX Series of Die Matrix expand sheetmachine evenly expands wafers in the X and Y directions sothat streets cross all chips.
This eliminates waste issues and facilities chip pickup in sucha way that makes mounting in die-bonding processes smoother.
Processing is done by expanding both the full cut wafer anddicing film on the expansion stage so that chip spacing and streetwidths meet design parameters.
ProductFeatures
- Uniform expansion of diced and/or fractured wafers.
- Expansion accuracy and precision repeatability.
- Expansion ratio and speed can be freely varied.
- Equipped with a heater expansion stage.
- Resin double rings for stabilizing and gripping expandedwafers. The inner ring functions as the expansion ring, while theouter ring grips the expanded wafer/film.
- Simple mechanism, maitenance free design.
TEX-21B Series
Wafer Size : Upto 6"inch
Demo Movie>> http://youtu.be/1ZdzTCcg1H0
Specification
CORPORATE PROFILE
Product Family
Technovision, Inc. Web :http://www.techvision.co.jp/english/
If you have any questions, pleasefeel free to contact us.
