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Description:
- High quality die matrix separator machine- Up to 8 inches wafer
- High accuracy expansion
- Compact tabletop
Overview
Wafers require carefully handling to ensure narrow streets andprevent edge chipping after dicing.
The TEX-220 of separator machine evenly expands wafers inthe X and Y directions so that streets cross all chips.
This eliminates waste issues and facilities chip pickup in sucha way that makes mounting in die-bonding processes smoother.
Processing is done by expanding both the full cut wafer anddicing film on the expansion stage so that chip spacing and streetwidths meet design parameters.
- Uniform expansion of diced and/or fractured wafers.
- Expansion accuracy and precision repeatability.
- Expansion ratio and speed can be freely varied.
- Equipped with a heater expansion stage.
- Resin double rings for stabilizing and gripping expandedwafers. The inner ring functions as the expansion ring, while theouter ring grips the expanded wafer/film.
- Simple mechanism, maitenance free design.
TEX-220
Wafer Size : Up to 8"inch
Technovision, Inc. Web page :http://www.techvision.co.jp/english/
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