Description:
Semi-auto 12 inch silicon wafer mounter- Both pre-cut & normal tape
- Adjustable speed and pressure
- bubble free
•Overview
This semi automatic 12inch silicon wafer mounter optimizes to applying wafer,
dicing frame and tapein semiconductor industry.
It improves performance in all ways: quality, operability andlamination repeatability.
It promises to meet diversifying customer demands for stableoperation that does not require special skills,
film-specific numerical control over lamination conditions,etc.
•Features
- Available for both pre-cut and normal film
- Lamination without air bubbles between wafer and film
- Adjustable speed in film lamination
- Adjustable pressure in film lamination
- The cutting span of the film can be adjusted
- An excellent touch panel in the functionality and operativenessis adopted
- Safety interlock function
* Support for several type of films.
* Wafer mounting process flow
*FM-6643 Image chart for pre-cut film.
* FM-6643 wafer loading area
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•Specifications
- VACUUM : UNDER -60kPa (6mm dia quick fitting)
- AIR : 0.4-0.5MPa (6mm dia quick fitting )
- Electricity : 220V AC 50/60Hz (3P plug)
*Another Voltage available
- Dimension : 1220(W) X 660(D) X 1620(H)
- Weight : 200kg approx.
- Option : Heater unit (Maximum Temp.:80 deg C) *Customizable
We accept test for wafer mountingevaluation.
* If you have any questions, please feel free tocontact us.
•Corporateprofile
Technovision, Inc. Web site >>>http://www.techvision.co.jp/english/
•Productfamilies
