Description:
- Manual tape mounter / wafer equipment- Bubble free lamination
- Available for customization
- Up to 6 inch silicon wafer
Manual Wafer Mounter / wafer equipmentFM-224 Series
Feature
- Quick mounting without airbubbles
- Equipped with horizontal andcircular cutters to remove unused film
- Automatic take-up of separatorfilm
- Available in three size, 150mm- 6inch silicon wafer , 200mm-8inch, 300mm-12inch
- Simple and Maintenance-freedesign
For Dicing Process
For rapid mounting of dicingframes, wafers, and film (tape).
Suitable for all types of dicingframes.
Specially-designed cutters cut thefilm efficiently with minimal damage to dicing frames.
For Back Grinding / SurfaceProtection
This model helps you mount film ona wafer to protect both pattern sides and backsides.
Can also be used to cut filmaccurately around the wafer perimeter using a specially designedcutter.
Purpose
For research and development use,semi-production use...
You can select a wide range of equipment.
NOTE
Other models are availableincluding mounters for die bonding film,
mounters that accommodate 2differing kinds of film.
* We''ll be also able to providesemi-customized product.
If youhave any questions, please feel free to contactus.
Web : Inquiry form >>>http://www.techvision.co.jp/english/contact/form.htm
