Description:
- 12 inch Semi-Automatic Wafer Mounting- Single machine for DAF, BG and dicing tape
- Adjustable speed
- easy to use
Overview
This semi-automatic wafer mountingequipment optimizes tape lamination.
It improves performance in all ways: quality, operability andlamination repeatability.
It promises to meet diversifying customer demands for stableoperation that does not require special skills, film-specificnumerical control over lamination conditions, etc.
Chart : Film lamination lamination scene
- Numerical management of lamination conditions
- Film roller system is automatically shuttled with amotor-drive
- Adjustable speed in film lamination
- Adjustable pressure in film lamination, with automatic filmroller system
- Available with non-contact chuck for film lamination
- Fit for multi-purpose applications via replacableattachments
- Easy to use
(Single machine for dicing, DAF, BG, and differing wafersizes)
Specification
FM-3343
Wafer Size : Up to 12"inch
Film Width : 410mm
Dimension : 525x940x415
Weight : 55kg approx
* We will also be able to customize on your specification.
Technovision, Inc. Web site(Eng) >>>http://www.techvision.co.jp/english/
If you have any questions, pleasefeel free to contact us.
Inquiry form >>>http://www.techvision.co.jp/english/contact/form.htm
