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Description:
- High quality die matrix expander- Up to 8 inches wafer
- Low Expansion
- Compact tabletop
- stretch rings
Wafers require carefully handling to ensure narrow streets andprevent edge chipping after dicing.
The LEX-218 of Die Matrix Expanding equipment evenlyexpands wafers in the X and Y directions a very little so thatstreets cross all chips.
This eliminates waste issues and facilities chip pickup in sucha way that makes mounting in die-bonding processessmoother.
Processing is done by expanding both the full cutwafer and dicing film on the expansion stage so thatchip spacing and street widths meet design parameters.
- Uniform expansion of diced and/or fractured wafers.
- Expansion accuracy and precisionrepeatability.
- Expansion ratio and speed can be freely varied.
- Equipped with a heater expansion stage.
- Resin double rings for stabilizing and gripping expandedwafers. The inner ring functions as the expansion ring, while theouter ring grips the expanded wafer/film.
- Simple mechanism, maitenance free design.
- Grip expanded wafer by grip rings / stretch rings.
TEX-218
Wafer Size : Up to 8"inch
Technovision, Inc. Web page :http://www.techvision.co.jp/english/
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