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Description:
sp;benefits:
- High compressibility, soft and flexible, designed for low-stress application environment
- Nice thermal conductivity
- Electrical insulation
- Meet with the environmental requirements of ROHS and UL
- Natural stickiness
Typical applications:
- Laptop
- Communication hardware equipment
- High-speed hard disk drive equipment
- Automobile engine control mould
- Micro processor, memory chip and graphics processor
- Mobile equipment
