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Description:
- Dicing, protecting wafers- UV curing type
- Improved back side chipping, contamination by water
Feature:
*Wafer dicing, Wafer protection
*UV curing type
*Expandable type
*Precented dicing wafer from penetrating into interface
*Improved back side chipping
*Improved back side contamination by wafer
*Adhesive strength depends on chip size, chip thickness, etc
Specification:
Tape Color: White
Tape Thickness: 130um
base Film: Polyolefin/100um
Adhesive: 30um
Adhesion before UV: 3.00 N/10mm
Adhesion after UV: 0.22 N/10mm
Note: UV irradiation should be satisfied thefollowing conditons in order to ensure the standard value
1) more than 100mW/cm2 of illuminance
2) more than 200mJ/cm2 of quantity of UV light
3) Wave length of ultraviolet should be around 365nm
