2

Bondingstrength

>650N/cm2

3

Solderability

Temperaturefor soldering tin: 235±5°C dip time lasts 5 second, fresh, glossyand connective solder covered on more than 95% area of bondingpad.

4

Resistance ofsolderability

Temperaturefor soldering tin: 260±5°C dip time lasts 20seconds, fresh, glossy and connective solder covered on morethan 95% area of bonding pad.