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GB/T4723-1992, Equivalent to IEC-249-2-2, NEMA: XPC

XPC Copper clad laminated sheet

Productname:SB-318 (XJ399) Copper clad laminate Productstandard:GB/T4723-1992, Equivalent to IEC-249-2-2, NEMA:XPC Characteristics andapplication:Technical requirements are shown in table 1 and2                     Table 1:Nominal thickness and tolerance Nominal thickness    mm Tolerance at single point   mm 0.8 ±0.09 1.0 ±0.11 1.2 ±0.12 1.6 ±0.14 2.0 ±0.15 Note:  1. Normal dimension: 1220±20mm×1020±20mm  Table 2: Technical requirements No. Item Unit Conditioning Normal Value Typical Value 1 Solder float at 260°C, min. s A 10 15 2 Peel strength   min. N/mm AS-5S/260°C -1.0 1.41.2 3 Flexural strength   min. MPa A 80 100 4 Water absorption   max. % E-24/50 D-24/23 - 1.8 5 Dissipation factor   max. - C-96/20/65C-96/20/65 D-48/50 -- 0.050.10 6 Dielectric constant   max. - C-96/20/65C-96/20/65 D-48/50 -- 5.56.0 7 Insulation resistance  min. MΩ C-96/20/65C-96/20/65 D-2/100 -- 5×10450 8 Volume resistivity  min. MΩ·m E-2/100C-96/20/65 C-96/40/90 10100 15180 9 Surface resistance  min. MΩ E-2/100C-96/20/65 C-96/40/90 301×103 701.5×103 10 Thermal resistance - E-1/180°C - No blistering and peeling-off 11 Alkali resistance - 5%NaOH, 40°C, 5min - Without notablechanges in appearance  Remarks: ALL data listed in above table are typical valuesfrom SB-318 (XJ-399) CCL in thickness of 1.6mm and with copper foilof 35μm.