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Description:

Parts for power semiconductor devices
Got ISO 9001 ISO 14001 OHSAS 18001
OEM service
Export to USA, Germany, and so on.

Main material:
Ceramic parts: ≥93.5% Al2O3
Glaze: color white or pink, T≥1, 450°
Flange: TU1 (OFHC Cu) or Ni42Fe58 alloy
Copper contact: TU1 (OFHC Cu)
Solder: Ag72Cu28 alloy
Gate tube: TU1 (OFHC Cu) or Ni42Fe58alloy

Technical specifications
The all products can reach to the below standards
Leak rate: ≤1 x 10-8 bar cm3/sec with helium
Flatness of copper surface: ≤0.008mm
Parallelism between copper surfaces: ≤0.03mm
Concentricity between flange and copper: ≤0.5mm
Pull test: ≥5kN/cm2
Temperature cycling: -65° - 200°, 5 circles
Nickel plating thickness: 2-7μm