Price:Negotiable
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Description:
HS fins with high density increase area of the heat dissipation
Full Cu material, molding success one time
Skiving craft wit
| Features: | | Server Type: | Passive | | Applicable scope: | Intel LGA 775 1U Server CPU cooler | | Main Process: | Skiving | | Heatsink Material: | Copper | | Heatsink Dimension: | 87(L)×83(W)×23(H)mm | | noise(dB): | 0dB | | heat conducting silicon: | AD 66 | | Other features: | Full Cu material, molding success one time |
ProductFeatures:- HS fins with high density increase area of the heatdissipation
- Full Cu material, molding success one time
- Skiving craft with high precision
- Easy and reliable to install with high steadiness
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