High purity ultra-fine silica powder isspecially processed by high purity quartz, its melting point is1713 degree, with no cleavage and only conchoidal fracture. It hasexcellent chemical stability and high insulation compressionresistance, and the breakdown voltage is 32-34KV/mm, with lowcoefficient of thermal expansion.

These excellent properties bring a broad prospect for it toapply in electronic information industry, electric power industry,coating industry, light industry, and so on. High purity ultra-finesilica powder is the preference filler in integrated circuit (IC),microproducts and mold compound, and it is also the main filler indry type encapsulating material for electricity transmissionsubstation equipment. Using ultra-fine silica powder as filler inthe mold compound and encapsulating material can make the packagedproducts have prominent features such as good resistance totemperature changes, small deformation, high insulation compressionresistance, etc.

Feature:

1. excellent chemical stability

2. high insulation compression resistance

3. low coefficient of thermal expansion

Application Fields:

1. Epoxy insulation encapsulant material / Epoxy MoldingCompound (EMC)

2. Copper Clad Laminate (CCL)

3. Electromagnetism Industry 

4. Electronic Industry

5. Ceramic Industry

6. The Aerospace Industry 

7. Glass Industry

8. Plastics Industry 

9. Grinding Material Industry

10. Coating Industry 

11. Investment Casting Industry

12. Thermal Insulation Product of Calcium Silicate

13. Refractory Material

Product Index: