Brand:THNM
MOQ:1000
Quantity:500
polishing slurry
Introduction
UPP/SAS03 Sapphire Substrate CMP Slurry is a newgeneration water-solubility high-purity colloid polishing slurryinvented by Jiangsu Tianheng Nanometer Technology Co., Ltd.Theproduct is mainly used in high quality polishing of sapphire.Highpolshing rate,high surface flatness and low roughness reachadvanced international level.Apply to warious treating way,havingcharacteristics of long using life-span,high smoothness,strongsuspension and easy to wash off.Its preminent function has also gotfull acknowledgment in applying to reality,and mainly used in thepolishing of sapphire,with high precision requirement.
Main Characteristic
UPP/SAS03 Sapphire Substrate CMP slurry is nanometerSIO2 hydrosol,with characteristic of little pollution,easilywashed,high polishing rate,small damage layer,processing componentsto avoid scratching the phenomenon,and high flatness.The ratio canbe optimized according to requirement.Compared with the same styleproduct of oversea,the virtues of the product are highconcentration,small abrasive size,small surface strain,easilywashed for organic,metal ion and particle,high polishing speed,nouniform etch pit.
Application
The product is mainly used in high quality polishing ofsapphire.
Fundmental parameter
| PH | Specific gravity | Viscosity( 25 °C,mPa.s ) | Abrasive particle size | Sodium oxide Concentration(%) | Abrasive concentration | Aspect |
| 11.0~12.0 | >1.10 | <10.0 | 100~120(nm) | <0.3 | >35% | Ivory |
Employ Method
The ratio of original polishing slurry to DI water is1:5,or adjust according to process.
During the polishing process,the recommendedamount of added alkaline polishing agent,polishing will help getbetter results.
Transportation
1.Temperature at5 °C ~50 °C .Avoidlight in order to avoid the slurry metamorphism.
2.Period of validity:1 year,propose to use out withinhalf year.
3.Avoid introduce with strong electrolyte;Avoidpollution of metal and patricle.
Package:25kg/barrel.
