The infos aboutthis aluminum large heatsink(bonded finheatsink):

1. Width,height,length,fins thickness, air gap can be modified according tocustomers'' design without molds.
2. Compared withextrusion heatsink, with same external size,bonded fin heatsinksincrease over twice of heat dissipation surface areas,so betterperformance of heat dissipation.
3. Excellentperformance of thermal spreadingwith densefin, butlow price.
4. Custommizedheatsinks can be made without molds.so various samples for testingcan be available.
5. Optimum designfor different types,associated design parameter isprovided.
6.  Widelyapplied in Appliances ,Electronic industry,Communication , Lightingand Newenergy device, especially such asheat semiconductor ( IGBT) cooling of UPS,Inverter,AC drivers andTransducer etc
7. Surfacetreatment: anodized (black),powder coated,polished,millfinished,sand blasting,wiredrawing and so on.
8. Material :Al 6063 T5 or according to customers''requirement. 

What characteristics makea heatsink a good one? There''s a number of factors toconsider: 

• High heatsink surface. It''s at the surface ofthe heatsink where the thermal transfer takes place. Therefore,heatsinks should be designed to have a large surface, this goal canbe reached by using a large amount of fine fins, or by increasingthe size of the heatsink itself.  
• Good aerodynamics. Heatsinks must be designedin a way that air can easily and quickly float through the cooler,and reach all cooling fins. Especially heatsinks having a verylarge amount of fine fins, with small distances between the finsmay not allow good air flow. A compromise between high surface(many fins with small gaps between them) and good aerodynamics mustbe found. This also depends on the fan the heatsink is used with: Apowerful fan can force air even through a heatsink with lots offine fins with only small gaps for air flow - whereas on a passiveheatsink, there should be fewer cooling fins with more spacebetween them. Therefore, simply adding a fan to a large heatsinkdesigned for fanless usage doesn''t necessarily result in a goodcooler.  
• Good thermal transfer within the heatsink.Large cooling fins are pointless if the heat can''t reach them, sothe heatsink must be designed to allow good thermal transfer fromthe heat source to the fins. Thicker fins have better thermalconductivity; so again, a compromise between high surface (manythin fins) and good thermal transfer (thicker fins) must be found.Of course, the material used has a major influence on thermaltransfer within the heatsink. Sometimes, heat pipes are used tolead the heat from the heat source to the parts of the fins thatare further away from the heat source.  
• Perfect flatness of the contact area. The partof the heatsink that is in contact with the heat source must beperfectly flat. A flat contact area allows you to use a thinnerlayer of thermal compound, which will reduce the thermal resistancebetween heatsink and heat source. 
• Good mounting method. For good thermaltransfer, the pressure between heatsink and heat source must behigh. Heatsink clips must be designed to provide a strong pressure,while still being reasonably easy to install. Heatsink mountingswith screws/springs are often better than regular clips.Thermoconductive glue or sticky tape should only be used insituations where mounting with clips or screws isn''tpossible.

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aluminium heatsink,bonded finheatsink