Max process size: 700 mm*1100mm
Copper thickness: 0.5oz--13oz
Min line width/space: 3mil/3mil
Finished min hole diameter: 0.15mm
Aspect ratio: 12:1
Surface finish: HASL/HASL lead free, Chemical tin, Chemical Gold,Immersion Silver/Gold, OSP, Gold plating
Solder mask color: Green/yellow/black/white/red/blue
Profiling: Punching, Routing, V-CUT, Beveling
base material:FR-4(S1130/S1141/S1170),Tg130/Tg170,Rogers,Berquist,thermagon,(taconic)
Standard:  RoHS, SGS, UKAS, ISO14001, DNV, UL

Packing: Vacuum Packing
The capacity of double-sided board: 60000 sq m/year
The capacity of multilayer board: 100000 sq m/year

We have:
Advanced equipment
Reliable quality
Reasonable price
High output
Quick delivery
Unlimited ordering quantity