Brand:Xinsheng
12 Layers 4.0m Immersion Gold FR4 Rigid Printed Custom PCB BoardFor Telecommunication
Material: FR4
Surface treatment: immersion Gold
Width/space: 4/4mil
Finish thickness: 4.0m
Min Hot:0.5mm
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Products are applied to a wide range of High-tech industries suchas: LED, telecommunication, computer application, lighting, gamemachine, industrial control, power, automobile and high-endconsumer electronics, ect.
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SPECIFICATION | ||||
Materials | Polyimide | Polyester ( PET) | Remark& | |
(Kapton) | Test Method | |||
1~8(Rigid-Flex & Multilayers ??FPC) | 1~2 | |||
Single Sided | 0.050 mm | |||
Double Sided | 0.075 mm | |||
Drilling P.T.H. | 0.2 mm | |||
Punching | 1.0 mm | |||
Conductor Width (W) | 0.025 mm | W0.5mm | ||
Hole Diameter (H) | 0.05 mm (withP.T.H.0.1mm) | H1.5mm | ||
Accumulated Pitch (P) | 0.05 mm (Special0.03mm) | P25mm | ||
Outline Dimension (L) | 0.05 mm | L50 mm | ||
Conductors and Outline (C) | 0.15 mm (Special 0.07mm) | C5.0 mm | ||
Conductors and Coverlay | 0.3~0.5 mm?? | |||
Surface Treatment on | Soft or Hard Ni/Au Sn/Pb (2~60??m) Primary FluxCarbon Printed 4~10??m Silver Gel printed | |||
Terminals and land Areas | ||||
Insulation Resistance | 1000MW | IPC-TM-650?? 2.6.3.2?? | ||
at Ambient | ||||
Dielectric Strength | 5KV | IPC-TM-650?? 2.5.6.1 | ||
Surface Resistance (W) | 5x012 | 2x015 | IPC-TM-650?? 2.5.17 | |
Volume Resistivity (W-cm) | 1x015 | 1x015 | IPC-TM-650?? 2.5.17 | |
Dielectric Constant (1 MHz) | 4 | 3.4 | IPC-TM-650?? 2.5.5.3 | |
Dissipation Factor (1 MHz) | 0.04 | 0.02 | IPC-TM-650?? 2.5.5.3 | |
Peeling Strength (180 irection) | 1.2kgf/cm | 1.2kgf/cm | IPC-TM-650?? 2.4.9 | |
Solder Heat Resistance | 260 .C/10secs | 210 .C/3secs | ||
Flammability | 94 V-0 | 94VTM-0 | UL94 | |
Water Absorption | 2.90% | 1.00% | ASTM D570% | |
(24 Hours) | ||||
