MOQ:100
Quantity:50000
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| Item | Mass production capability | Prototype production capability | Design capability | |
| Min.Trace Width/Space | 75/75um | 50/50um | 40/40um | |
| Inner Layer CopperThickness | ≤3OZ | ≤6OZ | ≤12OZ | |
| Inner Layer CoreThickness | ≥0.05mm | ≥0.04mm | 0.04mm | |
| Min. Hole Diamerter | Mechanical Drilling | 0.20mm | 0.1mm | 0.1mm |
| Laser Drilling | 0.1mm | 0.075mm | 0.03mm | |
| Min. Via to TraceSpace | PTH | 0.18mm | 0.15mm | 0.1mm |
| NPTH | 0.15mm | 0.125mm | 0.1mm | |
| Number of Layers/ Board Thickness | 20L/4.0mm | 30L/4.5mm | 40L/7.0mm | |
| Thin PCB Number of Layers /Thickness | 8L/0.8mm | 6L/0.3mm | 10L/0.6mm | |
| HDI(BuildUp) | 2+M+2 | 3+M+3 | 4+M+4 | |
| 2+M+2(stack up via) | 3+M+3(stack up via) | 4+M+4(stack up via) | ||
| Aspect Ratio | PTH | 15:1 | 17:1 | 25:1 |
| LVH | 0.8:1 | 1:1 | 1.5:1 | |
| Controlled Impedance | ±10% | ±7% | ±5% | |
| Materials | FR-4(High Tg,Halogen-free), FR-5, RCC, NELCO, FR-408 | BT, Polyimide,Lowεrmaterials | ||
| Special PCBTypes | Counter Sink, EdgePlating, Gold Fingers, Milling half hole. | Rigid-flex | ||
| FinishTreatments | OSP, HAL(Pb/Sn), Imm. Tin, OSP+ENIG, HALLead-free, ENIG, ImmersionSilver, GoldFingers+ENIG, PeelableMask, Carbon Paste+Dielectric PastePrinting. | |||
