XCG33-A5

     COG Bonding M/C

Application:

The machine is used for aligning and pre-bonding IC driver ontovarious LCD glasses.

Technic Application: âÂÂ??ÂÂ??SNT   âÂÂ??ÂÂ??CSTN     âÂÂ??ÂÂ??TFT

âÂÂ??ÂÂ??Key Feature:

1. Double cylinders of SUNSOM pressure system eliminateself-gravity of bond head. Minimum pressure is 0.1KG.
2. Combination of self-developed IC image and PLC program make theoperation simply and intuitively.
3. External vacuum pump, low consumption, applied to smallproduction.
4. Unique reversal structure suitable to various ICbonding.  
5. Japanese SMC precise pressure components,controlling system andhuman-machine interface.

âÂÂ??ÂÂ??Basic Parameter

Voltage:AC220V 50-60HZ 

Rating Power:0.5KW  

Operation Mode:7" interface    

Pressure:0.4-0.8Mpa 

Bond Head:Cylinder reversal work  

Work Mode:Single station fixedwork     

Position System:Superposition of IC image and LCD glassimage   

IC Loading:   Manual  

Position  Accuracy:    ±3-5um

Bond Head :L1-45mm   W1-5mm (Customization)

Thermocouple:K type

Fixture   Micrometer: adjust X-Y-θ 

Weight:100KG    

Dimension:L600 x W545 x H645mm

âÂÂ??ÂÂ??Front View and Side View

âÂÂ??ÂÂ?? Machine parameter and specification made to customerrequestâÂÂ??ÂÂ??