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| Description | Details Specification | |
| base Material | FR-4,Aluminium-backed board,Halogen-free,Lead-free compatible,High Tg,High CTI,CEM-1,CEM-3 etc. | |
| Mass production | Sample | |
| Max Dimension | 630x530mm | 630x530mm |
| Copper thickness of inner layer | 18-140um | 18-210um |
| Copper thickness of outer layer | 12-210um | 12-210um |
| Min.Annular ring | 0.10mm | 0.08mm |
| Min.solder mask clearance | 0.05mm | 0.05mm |
| Min.solder mask clearance | 0.045mm | 0.03mm |
| Impedance tolerance | ±10% | ±8% |
| Finished board thickness | 0.25mm-3.5mm | 0.20mm-4.0mm |
| Outline precision | ±0.1mm | ±0.08mm |
| Layers No. | 2-12layers | 2-14layers |
| Inner layer circuit | 4/4mil | 4/3mil or 3/4mil |
| Out layer circuit width/spacing | 4/4mil | 4/3mil or 3/4mil |
| Board Thickness | 0.1-1.6mm | 0.075-1.6mm |
| Min.drill bit size | 0.2mm | 0.15mm |
| Aspect ratio | 8:01 | 10:01 |
| Surface Finished type | HASL,Flash golds,ENIG,OSP(lead freecompatible),Carbon ink,Peelable S/M,HASL(lead free),Immersion silver/tin,Gold finger plating,ENIGgold finger plating,Immersion Silvergold finger plating | |
| Production type | High precision multi-layer board,Blind hole board, Buyerd hole board,High frequency board,Aluminium backed board | |
| Certificate | ISO9001.UL etc | |
