Brand:OEM Camera Controller
MOQ:1
Quantity:30
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or: #0000ff; font-size: 14px;">Specifications| Details | |
| Type of Assembly | THT(Through-hole Technology) / DIP |
| SMT (Surface-mountTechnology) | |
| DIP & SMTmixed | |
| Single or Double-sided mixedassembly | |
| PCB Board | Size: 330mm x 250mm ( 13.0″ x9.8″ ) |
| Thickness: 1.2mm~2.0mm | |
| PCB Shape | Rectangular |
| Round | |
| Slot | |
| Cutout | |
| Complex | |
| Irregular | |
| Components | Down to 0201 size chip and microBGA''s |
| BGA, QFN, QFP, DIP, SIP, CGA,DFN etc. | |
| Max. BGA size : 33.5 x33.5mm(1.32″ x1.32″) | |
| Max. IC size : 33.5 x33.5mm(1.32″ x1.32″) | |
| Max. QFP size : 33.5 x33.5mm(1.32″ x1.32″) | |
| Fine pitch to 0.05mm ( 1.97 mil) | |
| Max. Height: 20mm ( 0.79″) | |
| Accuracy: <40μm | |
| Component Packaging | Reel / Tape |
| Tube / Stick | |
| Tray | |
| Bulk | |
| Solder Type | Leaded, RoHS &Lead-Free |
| Water soluble solderpaste | |
| Manual soldering for specialparts | |
| Placer Speed | THT: 60,000 pins/hour |
| SMT: 90,000 pins/hour |
PCBAssembly Process
PCB AssemblyQuality Assurance
