Specifications 1. low odor 2.colorlessafter cure 3.cost-effective LK1110 is liquid two-component epoxyglue without solvent. It can cure in room temperature. When curing,it is non shrinkable, no toxicity, odorless. After cure, it hashigh peel strength, good electrical insulating property, goodresistance to vibration and temperature change. It is suitable forbonding materials such as ceramic, glass, metal, stone and etc. A BColor transparent light yellow Viscosity(mPa.s) (GB/T2794-1995)@25??C,Brookfield RVT Spindle 4,speed 20rpm, 30000-4000020000-30000 Specific Gravity(g./cm3) (GB/T13354-1992)@25??C 1.201.10 Flash Point, ??C 210 >240 Physical properties-curedadhesive Temperature Cure Speed Shear Stress (25??C) 3-4h 0.5-0.6kg/cm2 (70??C) 30min 2.3-2.6 kg/cm2 Volume Resistance@25??C2.8*1015 Ohm.cm Surface Resistance@25??C 3.6*1014 Ohm VoltageEndurance 20~22 KV/mm2 Tensile Strength 8~9 Kg/mm2 CompressiveStrength 15~16 Kg/mm2 Impact Strength 14~15 Kg/cm2 Hardness (ShoreD) 82 HDT 90??C Moisture Absorption (in 24h) <0.2% Coefficientof Linear Expansion 53.2*10-6 cm/??C Directions for use For bestperformance bond surfaces should be clean and free from grease. Usecleaners if necessary. Mix component A and B with wood stick orbamboo stick evenly according to weight proportion A:B=3:1 Use upthe mixed adhesive in a short period, for example, at 25??C, 100gmixture should be applied in 20 minutes. Generally speaking, 0.8cmglue paste is enough for normal bonding. Best effects when curingat 25??C~70??C, and bad performance when curing below 15??C.