PCB Capability: Max Layer Count for rigid PCB: 1-12 PCB BoardThickness: 14mil -175mil Drill to metal: 7mil Hole Size: 6mil Innerlayer Registration: 3mil Line Width & Space Inner/Outer:3mil/3mil (minimum) Aspect Ratio: Min Solder mask Dam: 2.5milControlled Impedance: /- 8% Max Internal Copper Wt.: 3 oz AdvancedTechnologies: Blind/Buried Via, HDI Micro via Surface Treatment:ENIG, OSP, Immersion Silver/Tin, Lead free HAL Materials: FR4, HighTg Epoxy, Halogen Free Certificates: ISO9001 and UL Price: Quitecompetitive especially for orders in huge quantities Productsapplication: Computer, Communication, Test & Control system,Medical Equipment etc. Lead Time: 5-20 days (Depends on Q''ty,production status etc. ) DeliIf you have interest in our serviceand products, please contact us freely.