type of assembly: SMT & Through-hole

Solder type: Lead and Lead free

Component: 0201 components
           Ballgrid array(BGA)
          complex double sided SMT assembly
          Through-hole and mixed technology assembly
           DIPsoldering

Type of service: Turn-kye, Partial Turn-key,Consignment

Testing: In circuit Testing
         Functionaltesting
         AOI Inspection

File format: Bom list in excel file
            gerber files
            Pick-N-Place File(SYRS)