The solder ball has good advantages of high pureness and cleanness, lustrous, uniform particles and exact weight.

Lead-free solder ball
Alloy:
1. Sn-AG
2. Sn-Cu
3. Sn-AG-Cu-Sp
4. According to the customers requirement

Common solder ball
Sn63Pb37
Sn62Pb36AG2
Sn60Pb40
Sn10Pb90

Model
For PBGA
For CSP
For monotype BGA
We can supply solder balls in different alloy according to customers requirement

Solder Balls used for BGA, CSP and Flip Chip packages have many kinds of manufacturing, such as: Atomizing 19 processes etc.
MBO-Doublink Solders Co., Ltd. Adopts special manufacturing process, reaches a high lever on the quality and characteristics, makes a high working efficiency and satisfies customer's demand.