Feature:
1. Asy Operation
2. Utomatic Lock & Unlock System
3. Ositioning By Double- Screw stems & 4 Support Sliders
4. Design Solder Ball Storage & Pour Tank
5. 8 Patented Technologies
6. Design ball storage at the top. Make re-balling more efficiency
7. Design tank at the top, easy to pour over paste with tank
8. Adjust the distance between stencil and IC via four height adjustment screws. Apply to different thickness IC re-balling
9. Double-screw stems move together with support sliders. Flexible to locate different size IC.
10. Four support sliders hold the 4 corners of the IC, more stable to enhance BGA re-balling in good condition.

8 Patented Technologies
Specifications:
Mode: SRD-6306-A
Maximum BGA Size: 45 X 45 mm
Minimum BGA Size: 10 X 10 mm
Body Dimension: ( L x W x H)90 * 90 * 32mm
base Dimension: ( L X W )100 * 100 mm
Height: 80mm
Width (Include Holder): 900 gram
Stencil Shape Size: 89.5 * 89.5 mm
Stencil Hole Size: 81 * 81 mm