Product Name: Cutting machine for Semiconductor Industries
Main Function:
Affix polyamide tape onto the connector leads in strip form (2 or 4 sides) by applying precision temperatures and pressure to prevent leads shift in next process.
Specification:
- Linear high speed & high accuracy servo feeding mechanism (0.015 mm).
- Throughput: 40 ~ 45 strips per minute.
- Interchangeable tape affixation driven mechanism (cylinder driven: normal application; servo driven: fine application).
- Automatic on-load & off-load pick & place system with buffer to enhance operation throughput.
Application: - Lead frame manufacturer.
about us:
We GD Tech——Vertical Integration Towards Custom Automation
Typical Project Lead Time: 2-6 Months
Our Strength:
1. A team of mechanical, electrical and software engineers with vast experience in custom automation design.
2. Cost competitiveness with global SCM
3. Diversification of businesses covering from Electronic (semi-conductor, SMT and HDD) to Medical to Consumer Products (house-hold appliance) to Tele-communications etc.
4. Value add with after sales & training services
5. Aggressive time-line to meet customers’ delivery schedule.
Our Automation Solutions:
* High Speed Vision Technology
* Precision Alignment
* Production Automation
* Motion Control Technology
* Software Integration
* CCD Line Scanning
* Surface Quality Inspection
* Edge Detection & Measurement
* Pattern Defect Inspection
For General Information, kindly refer as below:
| Manufacturing Type | Milling, Turning, Drilling, Grinding, Welding, Tooling, Sheet metal Work, Broaching, Wire EDM, Laser Machining etc. |
| Material | Steel, Stainless Steel, Brass, Aluminum, Alloy, Copper, Engineering Plastics, Others (Inconel, Hastelloy etc.) |
| Product Segmentation | Precision Machining (Max Processing Capability: 4.2M×2.1M); Welding (Electric Arc / TIG Welding, Brazing); Modular Assembly; Custom Automation & System Integration. |
| Serving Industries | Aerospace, Medical, Semicon, Energy, Consumer Product and Telecom. |
| Surface Treatment | Hard Anodizing, Teflon Coating, TiO2 Coating, Silver Plating, Nickel Plating, Polishing, Oxiding,Sand Casting, Heat-Treatment. |
| Cleaning (Vacuum Application) | Class 100 Chemical Cleaning. |
| Polishing (Vacuum Application) | Ra 0.4 um - 0.8 um |
| Tolerance/ Precision | ± 0.005mm |
| Vacuum Leak-Test Capability | Less than 1x 10-10 mbar x l/s |
| Package | Class 1,000 Vacuum Packing for Part Level; Vacuum Plastic Tray Packing for Modular Assembly Level; Wooden crate packing for Equipment / Modular Assembly Level. |
| Engineering Design Capability | Solidworks, Pro/Engineer, Mastercam, AutoCAD. |
| Manufacturing Equipments | CNC 5 Axis, CNC 3 Axis, CNC Horizonal, CNC Lathe, EDM, Grinding, Conventional. |
| QA Equipments | CMM, metal Analyser, Profile Projector, Height Gage, Hardness Tester, Roughness Tester, Coating Thickness Tester etc. |
| Certification | ISO9001, QC08000, ISO13485(Medical), AS9100 (Aerospace). |
