Advantages as follows:
1. OEM service
2. Lead time of samples: 3-5 days
3. Mass production: Within 7 working days
4. FedEx, UPS DHL, EMS are available
5. FPC can be packed with plastic packaging

Product Range for your information:
Single sided up to 16-Layer PCB
Blind & buried vias
HDI capable - down to min. 3 mil LW
Heavy copper capable
RF board capable
Ceramic board capable
Surface treatment - RoHS compliant option available
- HASL
- Lead Free HASL
- ENIG
- Immersion Tin/Silver/Gold
- Plating Gold
- Gold Finger
- OSP

Spec as follows for your information:
1. Layers No. 1-12layers
2. Finished Board Thickness Min.: 10x15mm Max.: 520x330mm
3. Available Laminates Material PI. PET, PEN
4. Finished Board Thickness tol. ± 0.01mm
5. Finished hole diameter(Min. ) 0.1mm
6. Finished hole diameter(Max) 0.6mm
7. NPTH Hole diameter tolerance ± 0.025mm
8. PTH hole diameter tolerance ± 0.050mm
9. Copper foil thickness 12um, 18um, 35um, 70um
10. Circuit width/spacing(Min. ) ≥ 0.065mm(1/2oz)≥ 0.05mm(1/3oz)
11. Surface Finished type OSP. Gold plating, Immersion Gold, Tin plating(lead free)etc.
12. Gold Flash Ni/Au thickness Ni: 2.54-9um Au: 0.025-0.5um
13. Immersion Tin thickness 0.7-1.2um
14. Tin plating thickness 3-15um
15. Drill hole position tolerance ± 0.05mm
16. Punching dimension tolerance ± 0.05mm
17. Certificate: UL, ISO9001 SGS