Specification:
Number of Layer: Single-layer / double-layer /
Layers: 1 to 15
Copper Thichness: 0.5-4 oz
Laminate material: FR4 / FR1 / CEM1
base Board Thickness: 0.3-4.0mm
Surface Finishing: OSP / HAL / Immersion AU, Silver / Soft Au, Nel Plating / Gold Finger
Twist: 0.5%
Insulation resistance: 10(11)
Test voltage: 150V-300V
Termal cycling ability 288C 5second
Finished board area: 560x610mm
Min. Line Width and Spacing: 0.1mm/0.1mm
Copper thichness in hole: 25.0 um
Mini. Pad diameter inner layer: 0.5mm
Mini. Hole Diameter: 0.25mm
Hole tolerance PTH: +0.075mm NPTH: +0.05mm
Hole location tolerance: +0.075mm
Profile tolerance CNC Routing: +0.15
Profile tolerance CNC Punching: +0.15
Solder mask bridge ability: 0.1mm
Solder mask rigidity: 6H
Solderable test: 245C 5second
Imcombustibility: 94V 0
Inner packing: Vacuum packing / Plastic packing
Outer packing: Standard carton packing