Polyimide Masking Discs carrying the following characteristics:

1)High temperature resistance, can reach to 300C.

2)Super-sticky, insulation and anti-static.

Application:

1)Mask for printed circuit boards during wave solder or solderdip process.

2)Masking for some electronic component from ESD damage, apply for notes in electronic manufacturing.

3)Applications requiring heat resistant masking, as input mounting reflow process, and the manufacturing process of all types of electronic components.

Technical Parameters:

Product
Backing Thickness (mm)
0.025

Total Tape Thickness (mm)
0.060

Adhesion to Steel (N/25mm)
5.5

Tensile Strength at Break (N/cm)
58

Elongation at Break (%)
60

Surface restistance (ohms)
>106

StaticCharge
(v)
Removal from roll
<30

Removal from sus
<30

Dielectric Strength(V)
4000

Upmost use Temperature (° C)
280