Used for the firing of the process of semiconductor material, powder metallurgy, reduction treatment protected by gas. The furnace body is adopted doubly sealed by chamber and shell, and there is firing casing seal or gas casing seal at the furnace port.

Technical parameter
Working temperature: 800-1350 C
Stability: ??2 C  
Chamber dimension: 6000-10000*320*150mm(L*W*H)
Pushing speed: 200~1000mm/h (continuous regulating)
Protecting gas: N2, H2