CMP ring is a key component in chemical mechanical polishing; it has great influences on wafer quality and production efficiency. CMP process is a critical technique in fabrication process. Chung King is dedicated to develop the ideal material for better abrasion duration, reducing the stoppage time caused by changing tired CMP ring. CMP provided by Chung King, can be used in a longer lifetime and reduce the pollution on wafer effectively, and hence the cost per wafer can be come down.

Application
The wafer is made by cutting the crystalline rod. The cut wafer has rough surface, which cannot use for circuit, and need to planarization. CMP is used to eliminate the dielectric and metal layer on wafer surface, to achieve wafer planarization. The later procedures of CMP are thin film deposition, etching process. CMP is so called chemical mechanical polishing, wafer surface planarization.