Our PCB Production Capability

base Material FR4/CEM/Aluminum/Non-halogen
Layer Count 1-20 layer
Thickness of Board 0.2-3.0mm
Thickness of base Copper 17um-105um
Finishing HAL(LF)/Immersion gold(ENIG)/Gold finger/OSP
Profile Routing/Punching
Min. Hole 0.2mm ( 8 mil )
Min. Line width 0.1mm ( 4 mil )
Min. Line spacing 0.1mm ( 4 mil )
Solder mask Thickness: 16~35um
S/M bridge: Min: 5mil
Hole size of plug: 0.3~0.55mm
Certificate UL-796 certified (E334023)
ISO 9001: 2008
ISO14001: 2004
Leadtime sample: Double-layer: 1-3 days; Multi-layer: 2-5 days
Mass: Double-layer: 3-7 days; Multi-layer: 7-9 days